High-Resolution
High-definition images presenting minute parts and high-density PCBs in stunning clarity
Able to accurately inspect a range of parts with extremely clear imagery, the 3D-AOI inspects 0402mm and 0201mm components, as well as detailing narrow pitch IC and narrow pad parts
Achieving the impossible – high-resolution imagery with an expanded height measurement range
The 3D-AOI maintains high resolution while expanding the height measurement range, achieving comprehensive inspection of both extremely small-sized and tall components. The height measurement range is up to 25mm with the resolution 8µm / 15µm camera alone, and can be expanded to 40mm when combined with the Z-axis option
Fastest in the Industry
Unparalleled AOI cycle times with both 8µm and 15µm resolution cameras
Enjoy speeds of 4,500mm²/sec with the 8µm camera and 7,000mm²/sec with the 15µm camera.
With the ability to handle components as small as 0402mm, the 15µm camera is ideal for high-volume products and those where speed is essential.
High-speed image data processing
Imaging, image data processing, and inspection are all performed in parallel – resulting in near-zero wait times.
Hardware operation and image processing are fully optimized thanks to the in-house development of customized software.
Scalability
Upgradeable options enable a variety of board inspections with a single inspection machine
Upgrades enable continuous up-to-date performance and a wider range of inspection use from a sole unit.
Dome Lighting
Solder shape inspection
Side Cameras
Solder inspection of back-side electrode parts and connector parts; bridge inspection
Z-Axis
Inspection of tall components; inspection of boards with a mixture of small and tall components; inspection of solder close to the board surface
Conformal Coating Inspection (CCI) possible with UV lighting*
CCI detects coverage / non-coverage areas on the entire PCB.
Extra Component Detection (ECD) is also possible.
*Optical unit for UV lighting optional.
Insertion Inspection Solution
Saki provides a wide range of inspection solutions suitable for tall inserted components, such as character and polarity inspection of tall parts, and simultaneous measurement of the solder on the board and the height of tall parts. (With Z-axis option)
Back-Side Solder Inspection Solution
The 3D-AOI automates solder inspection, supporting flow, dip, and selective soldering.
Automation guarantees a more consistent quality than visual inspection, improving the solder inspection process and saving on labor.
THT solder inspection algorithm
Using 3D information, one algorithm covers all the necessary inspection items such as pin height, solder fillet height, and bridge inspection.
Extra Component Detection (ECD) doesn’t miss any fallen objects or surplus parts
By generating statistical sample data from approximately ten defect-free images, defects such as unexpected surplus parts, solder balls, and dust in the board can be automatically detected. Even without prepared samples, defects such as solder balls can be detected using design data and threshold information.
